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اصل مقاله 632.38 K

Optimizing Printed Circuit Board Assembly Mounting Support Through Experimental Modal Analysis, Finite Element Verification, and Vibration Testing

پذیرفته شده برای ارائه شفاهی ، صفحه 1-8 (8)
کد مقاله : 1094-ISAV2023 (R2)
نویسندگان
1Center of Advanced Systems and Technologies (CAST), School of Mechanical Engineering, University of Tehran
2استاد دانشکده فنی دانشگاه تهران
چکیده
Vibration analysis of printed circuit boards (PCBs) plays a pivotal role in ensuring the reliability and performance of electronic devices exposed to mechanical stress and vibrations during their operational lifespan. This paper delves into the intricate interplay of mounting configurations on the natural frequencies and vibrations of a microcontroller component strategically positioned at the center of a printed circuit board (PCB). The study commences with a detailed simulation of the PCB using ANSYS software, further refining the physical properties of the Printed Circuit Board Assembly (PCBA) to optimize its performance. This optimization process hinges upon the insights derived from experimental modal analysis facilitated by modal hammer testing. Subsequently, a comprehensive sinusoidal sweep test is meticulously executed on the PCBA, employing three distinct mounting configurations. The velocities of various critical points on the PCBA are judiciously measured through the utilization of a Doppler laser. The selection of the safest mounting configuration for the PCBA is predicated upon the discerned local and global frequency response functions, thereby bolstering the PCB's reliability and performance under mechanical stress and vibrations. The sweep test is conducted with an electrodynamic shaker, ensuring precise and controlled excitation throughout the experimental process.
کلیدواژه ها
موضوعات
 
Title
.Optimizing Printed Circuit Board Assembly Mounting Support Through Experimental Modal Analysis, Finite Element Verification, and Vibration Testing
Authors
Abstract
Vibration analysis of printed circuit boards (PCBs) plays a pivotal role in ensuring the reliability and performance of electronic devices exposed to mechanical stress and vibrations during their operational lifespan. This paper delves into the intricate interplay of mounting configurations on the natural frequencies and vibrations of a microcontroller component strategically positioned at the center of a printed circuit board (PCB). The study commences with a detailed simulation of the PCB using ANSYS software, further refining the physical properties of the Printed Circuit Board Assembly (PCBA) to optimize its performance. This optimization process hinges upon the insights derived from experimental modal analysis facilitated by modal hammer testing. Subsequently, a comprehensive sinusoidal sweep test is meticulously executed on the PCBA, employing three distinct mounting configurations. The velocities of various critical points on the PCBA are judiciously measured through the utilization of a Doppler laser. The selection of the safest mounting configuration for the PCBA is predicated upon the discerned local and global frequency response functions, thereby bolstering the PCB's reliability and performance under mechanical stress and vibrations. The sweep test is conducted with an electrodynamic shaker, ensuring precise and controlled excitation throughout the experimental process.
Keywords
finite element analysis, Modal Analysis, printed circuit board, mounting configuration
مراجع
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. Casen, A. and Lindström, F., 2023. Modeling vibration of printed circuit board assembly to predict component damage.